A press briefing for the 16th China International Nanotechnology Industry Expo (CHInano 2026) was held on Oct. 15 in Suzhou Industrial Park (SIP). It was announced at the meeting that the expo will be held from October 21 to 23 at the Suzhou International Expo Center. More than 150 national-level talents and over 400 world-leading scientists, renowned entrepreneurs and industry experts will attend the event, which features one keynote forum, 14 frontier thematic conferences, three industry matchmaking sessions, one innovation and entrepreneurship competition, as well as nano-enterprise study tours.
Since its debut in 2010, the expo has grown into a major global platform for nanotechnology exchange. As a key witness and driver of the development of the nano industry in Suzhou Industrial Park, it has been comprehensively upgraded this year, focusing on core priorities such as domestic substitution, mass production, and industry-university-research collaboration.
In line with SIP’s “623” industrial system and its development plans for six future industries, the CHInano 2026 will host a series of thematic forums and seminars centering on key areas such as AI empowerment, atomic-level manufacturing, optoelectronic technologies, and advanced materials. The 14 sub-forums will cover key sub-sectors such as MEMS manufacturing, MEMS devices and processes, analysis and testing, metrology and calibration, nanoimprint lithography, flexible electronics, atomic-level manufacturing, third-generation semiconductors, and material applications.
This year’s expo will set up 450 standard booths in a planned exhibition area of 26,000 square meters. With a layout of “one main nanotechnology exhibition area + three special-themed exhibitions + eight special zones/pavilions”, it will bring together over 350 high-quality enterprises in fields such as micro-nano manufacturing, semiconductors, optoelectronics, and new materials. Exhibits span the entire industrial chain, covering upstream core materials and equipment, mid-stream chip fabrication, packaging and testing, and downstream end-user applications.
